BibTeX record journals/corr/abs-0711-3323

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@article{DBLP:journals/corr/abs-0711-3323,
  author    = {Jeong{-}Won Yoon and
               Hyun{-}Suk Chun and
               Ja{-}Myeong Koo and
               Seung{-}Boo Jung},
  title     = {Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic
               Applications},
  journal   = {CoRR},
  volume    = {abs/0711.3323},
  year      = {2007},
  url       = {http://arxiv.org/abs/0711.3323},
  eprinttype = {arXiv},
  eprint    = {0711.3323},
  timestamp = {Mon, 13 Aug 2018 16:47:33 +0200},
  biburl    = {https://dblp.org/rec/journals/corr/abs-0711-3323.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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