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2020 – today
- 2023
[c12]Guangyuan Zhao
, Baozhen Li, Xu Huang:
Tomato leaf disease identification based on attention and inception mechanism. AIPR 2023: 557-563- 2022
- [c11]Ernest Y. Wu, Ron Bolam, Baozhen Li, Tian Shen, Barry P. Linder, Griselda Bonilla, Miaomiao Wang, Dechao Guo:
A Flexible and Inherently Self-Consistent Methodology for MOL/BEOL/MIMCAP TDDB Applications with Excessive Variability-Induced Degradation. IRPS 2022: 2 - [c10]Ernest Y. Wu, Baozhen Li:
Quantum Mechanical Connection of Schottky Emission Process and Its implications on Breakdown Methodology and Conduction Modeling for BEOL Low-k Dielectrics. IRPS 2022: 10
2010 – 2019
- 2019
- [c9]Andrew Kim, Ernest Y. Wu, Baozhen Li, Barry P. Linder:
Transformation of Ramped Current Stress VBDto Constant Voltage Stress TDDB TBD. IRPS 2019: 1-5 - [c8]Ernest Y. Wu, Baozhen Li, James H. Stathis, Andrew Kim:
Comprehensive Methodology for Multiple Spots Competing Progressive Breakdown for BEOL/FEOL Applications. IRPS 2019: 1-8 - 2018
- [c7]Andrew Kim, Baozhen Li, Barry P. Linder:
Transient self-heating modeling and simulations of back-end-of-line interconnects. IRPS 2018: 2-1 - [c6]Ernest Y. Wu, Andrew Kim, Baozhen Li, James H. Stathis:
Elapsed-time statistics of successive breakdown in the presence of variability for dielectric breakdown in BEOL/MOL/FEOL applications. IRPS 2018: 3 - [c5]Baozhen Li, Andrew Kim, Paul McLaughlin, Barry P. Linder, Cathryn Christiansen:
Electromigration characteristics of power grid like structures. IRPS 2018: 4 - 2015
- [c4]Baozhen Li, K. Paul Muller, James D. Warnock, Leon J. Sigal, Dinesh Badami:
A case study of electromigration reliability: From design point to system operations. IRPS 2015: 2 - [c3]Ernest Y. Wu, James H. Stathis, Baozhen Li, Barry P. Linder, Kai Zhao, Griselda Bonilla:
A critical analysis of sampling-based reconstruction methodology for dielectric breakdown systems (BEOL/MOL/FEOL). IRPS 2015: 2 - 2014
- [j4]Baozhen Li, Cathryn Christiansen, Dinesh Badami, Chih-Chao Yang:
Electromigration challenges for advanced on-chip Cu interconnects. Microelectron. Reliab. 54(4): 712-724 (2014)
2000 – 2009
- 2008
- [c2]Shengnan Xu, Baozhen Li, Yanhua Shao:
Neural Network Approach Based on Agent to Predict Stock Performance. CSSE (1) 2008: 1223-1225 - 2006
- [j3]Baozhen Li, Emmanuel Yashchin, Cathryn Christiansen, Jason Gill, Ronald Filippi, Timothy D. Sullivan:
Application of three-parameter lognormal distribution in EM data analysis. Microelectron. Reliab. 46(12): 2049-2055 (2006) - 2004
- [j2]Baozhen Li, Timothy D. Sullivan, Tom C. Lee, Dinesh Badami:
Reliability challenges for copper interconnects. Microelectron. Reliab. 44(3): 365-380 (2004) - [c1]Baozhen Li, Nana Li, Xianfeng Liu:
Transformation & Countermeasures on Business Operation Models in Uncertain Environment. ICEB 2004: 1001-1003 - 2002
- [j1]Fen Chen, Rolf-Peter Vollertsen, Baozhen Li, Dave Harmon, Wing L. Lai:
A new empirical extrapolation method for time-dependent dielectric breakdown reliability projections of thin SiO2 and nitride-oxide dielectrics. Microelectron. Reliab. 42(3): 335-341 (2002)
Coauthor Index
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