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ORCIDT. Y. Lin
This is just a disambiguation page, and is not intended to be the bibliography of an actual person. Any publication listed on this page has not been assigned to an actual author yet. If you know the true author of one of the publications listed below, you are welcome to contact us.
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2010 – 2019
- 2012
[j11]M. T. Yu, T. Y. Lin, C. Hung:
Sequential quadratic programming method with a global search strategy on the cutting-stock problem with rotatable polygons. J. Intell. Manuf. 23(3): 787-795 (2012)- [c9]Chris Tseng, Nishant Patel, Hrishikesh Paranjape, T. Y. Lin, SooTee Teoh:
Classifying twitter data with Naïve Bayes Classifier. GrC 2012: 294-299
2000 – 2009
- 2005
- [j10]Wesley W. Chu, T. Y. Lin:
Introduction. Appl. Intell. 22(1): 7 (2005) - [j9]Y. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin:
New encapsulation development for fine pitch IC devices. Microelectron. Reliab. 45(7-8): 1222-1229 (2005) - [c8]Priya Baliga, T. Y. Lin:
Kolmogorov complexity based automata modeling for intrusion detection. GrC 2005: 387-392 - [c7]Churn-Jung Liau, T. Y. Lin:
Reasoning about relational granulation in modal logics. GrC 2005: 530-534 - 2004
- [j8]T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma:
The impact of moisture in mold compound preforms on the warpage of PBGA packages. Microelectron. Reliab. 44(4): 603-609 (2004) - 2003
- [j7]T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu:
Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. Microelectron. Reliab. 43(5): 803-809 (2003) - [j6]T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua:
Development of the green plastic encapsulation for high density wirebonded leaded packages. Microelectron. Reliab. 43(5): 811-817 (2003) - [j5]Y. F. Yao, T. Y. Lin, K. H. Chua:
Improving the deflection of wire bonds in stacked chip scale package (CSP). Microelectron. Reliab. 43(12): 2039-2045 (2003) - 2002
- [j4]T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai:
The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. Microelectron. Reliab. 42(3): 375-380 (2002) - 2001
- [j3]T. Y. Lin, Vladik Kreinovich:
A Special Session on Granular Computing and Interval Computations at the 19th International Conference of the North American Fuzzy Information Processing Society (NAFIPS) Atlanta, Georgia, July 13-15, 2000. Reliab. Comput. 7(1): 71-72 (2001)
1990 – 1999
- 1996
- [j2]T. Y. Lin:
Guest Editorial. Intell. Autom. Soft Comput. 2(2): 93-94 (1996) - [j1]Y. Y. Yao, T. Y. Lin:
Generalization of Rough Sets using Modal Logics. Intell. Autom. Soft Comput. 2(2): 103-119 (1996) - 1994
- [c6]T. Y. Lin:
Anomaly detection: a soft computing approach. NSPW 1994: 44-53 - 1993
- [c5]T. Y. Lin:
Bell and LaPadula axioms: a "new" paradigm for an "old" model. NSPW 1993: 82-93 - [c4]T. Y. Lin:
Concurrent automata, database computers, and security: a "new" security paradigm for secure parallel processing. NSPW 1993: 94-104
1980 – 1989
- 1989
- [c3]T. Y. Lin:
Extensions of pushdown automata and Petri nets. ACM Conference on Computer Science 1989: 414 - [c2]T. Y. Lin:
Topological data models and approximate retrieval and reasoning. ACM Conference on Computer Science 1989: 453 - 1988
- [c1]T. Y. Lin:
Neighborhood systems and relational databases. ACM Conference on Computer Science 1988: 725
Coauthor Index
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