"Improving the deflection of wire bonds in stacked chip scale package (CSP)."

Y. F. Yao, T. Y. Lin, K. H. Chua (2003)

> Home

Details and statistics

DOI: 10.1016/S0026-2714(03)00211-7

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/YaoLC03
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/YaoLC03
Y. F. Yao, T. Y. Lin, K. H. Chua:
Improving the deflection of wire bonds in stacked chip scale package (CSP). Microelectron. Reliab. 43(12): 2039-2045 (2003)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.