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"Improving the deflection of wire bonds in stacked chip scale package (CSP)."
Y. F. Yao, T. Y. Lin, K. H. Chua (2003)
- Y. F. Yao, T. Y. Lin, K. H. Chua:
Improving the deflection of wire bonds in stacked chip scale package (CSP). Microelectron. Reliab. 43(12): 2039-2045 (2003)
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