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"Improving the deflection of wire bonds in stacked chip scale package (CSP)."

Y. F. Yao, T. Y. Lin, K. H. Chua (2003)

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DOI: 10.1016/S0026-2714(03)00211-7

access: closed

type: Journal Article

metadata version: 2020-02-22

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Y. F. Yao, T. Y. Lin, K. H. Chua:
Improving the deflection of wire bonds in stacked chip scale package (CSP). Microelectron. Reliab. 43(12): 2039-2045 (2003)

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