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"New encapsulation development for fine pitch IC devices."

Y. F. Yao et al. (2005)

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DOI: 10.1016/J.MICROREL.2004.10.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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Y. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin:
New encapsulation development for fine pitch IC devices. Microelectron. Reliab. 45(7-8): 1222-1229 (2005)

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