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2010 – 2019
- 2015
[c4]Chuan-An Cheng, Ryuichi Sugie
, Tomoyuki Uchida, Kou-Hua Chen, Chi-Tsung Chiu, Kuan-Neng Chen:
Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration. 3DIC 2015: TS8.12.1-TS8.12.4- 2014
- [j1]Po-Tsang Huang, Shang-Lin Wu, Yu-Chieh Huang, Lei-Chun Chou, Teng-Chieh Huang, Tang-Hsuan Wang, Yu-Rou Lin, Chuan-An Cheng, Wen-Wei Shen, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Ho-Ming Tong:
2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications. IEEE Trans. Biomed. Circuits Syst. 8(6): 810-823 (2014) - [c3]Po-Tsang Huang, Lei-Chun Chou, Teng-Chieh Huang, Shang-Lin Wu, Tang-Shuan Wang, Yu-Rou Lin, Chuan-An Cheng, Wen-Wei Shen, Kuan-Neng Chen, Jin-Chern Chiou, Ching-Te Chuang, Wei Hwang, Kuo-Hua Chen, Chi-Tsung Chiu, Ming-Hsiang Cheng, Yueh-Lung Lin, Ho-Ming Tong:
18.6 2.5D heterogeneously integrated bio-sensing microsystem for multi-channel neural-sensing applications. ISSCC 2014: 320-321 - 2011
- [c2]Kuan-Neng Chen, Z. Xu, Fei Liu, Cheng-Ta Ko, Chuan-An Cheng, W. C. Huang, H. L. Lin, C. Cabral, Zhi-Cheng Hsiao, N. Klymko, Hsin-Chia Fu, Y. H. Chen, Jian-Qiang Lu, Wei-Chung Lo:
Cu-based bonding technology for 3D integration applications. 3DIC 2011: 1-4 - 2010
- [c1]Cheng-Ta Ko, Kuan-Neng Chen, Wei-Chung Lo, Chuan-An Cheng, Wen-Chun Huang, Zhi-Cheng Hsiao, Huan-Chun Fu, Yu-Hua Chen:
Wafer-level 3D integration using hybrid bonding. 3DIC 2010: 1-4
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