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"Electrical investigation of Cu pumping in through-silicon vias for BEOL ..."
Chuan-An Cheng et al. (2015)
- Chuan-An Cheng, Ryuichi Sugie
, Tomoyuki Uchida, Kou-Hua Chen, Chi-Tsung Chiu, Kuan-Neng Chen
:
Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration. 3DIC 2015: TS8.12.1-TS8.12.4
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