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Rudolf Schlangen
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Journal Articles
- 2014
- [j7]Clemens Helfmeier, Rudolf Schlangen, Christian Boit:
Focused ion beam contact to non-volatile memory cells. Microelectron. Reliab. 54(9-10): 1798-1801 (2014) - 2010
- [j6]Rudolf Schlangen, Hervé Deslandes, Ted R. Lundquist, C. Schmidt, Frank Altmann
, K. Yu, A. Andreasyan, S. Li:
Dynamic lock-in thermography for operation mode-dependent thermally active fault localization. Microelectron. Reliab. 50(9-11): 1454-1458 (2010) - 2009
- [j5]Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Ted R. Lundquist, Peter Egger, Christian Boit:
Physical analysis, trimming and editing of nanoscale IC function with backside FIB processing. Microelectron. Reliab. 49(9-11): 1158-1164 (2009) - 2008
- [j4]Christian Boit, Rudolf Schlangen, Uwe Kerst, Ted R. Lundquist:
Physical Techniques for Chip-Backside IC Debug in Nanotechnologies. IEEE Des. Test Comput. 25(3): 250-257 (2008) - 2007
- [j3]Rudolf Schlangen, Uwe Kerst, Christian Boit, Tahir Malik, Rajesh Jain, Ted R. Lundquist:
Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy. Microelectron. Reliab. 47(9-11): 1523-1528 (2007) - 2006
- [j2]Rudolf Schlangen, Peter Sadewater, Uwe Kerst, Christian Boit:
Contact to contacts or silicide by use of backside FIB circuit edit allowing to approach every active circuit node. Microelectron. Reliab. 46(9-11): 1498-1503 (2006) - 2005
- [j1]Rudolf Schlangen, Uwe Kerst, A. Kabakow, Christian Boit:
Electrical Performance Evaluation of FIB Edited Circuits through Chip Backside Exposing Shallow Trench Isolations. Microelectron. Reliab. 45(9-11): 1544-1549 (2005)
Conference and Workshop Papers
- 2007
- [c2]Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Christian Boit, Rajesh Jain, Tahir Malik, Keneth R. Wilsher, Ted R. Lundquist, Bernd Krüger:
Backside E-Beam Probing on Nano scale devices. ITC 2007: 1-9 - 2005
- [c1]Uwe Kerst, Rudolf Schlangen, A. Kabakow, Erwan Le Roy, Ted R. Lundquist, Siegfried Pauthner:
Impact of back side circuit edit on active device performance in bulk silicon ICs. ITC 2005: 9
Coauthor Index
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