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2020 – today
- 2022
[c4]Ashish Nayak, HsinChen Chen, Hugh Mair, Rolf Lagerquist, Tao Chen, Anand Rajagopalan, Gordon Gammie, Ramu Madhavaram, Madhur Jagota, C. J. Chung, Jenny Wiedemeier, Bala Meera, Chao-Yang Yeh, Maverick Lin, Curtis Lin, Vincent Lin, Jiun Lin, Y. S. Chen, Barry Chen, Cheng-Yuh Wu, Ryan ChangChien, Ray Tzeng, Kelvin Yang, Achuta Thippana, Ericbill Wang, Shih-Arn Hwang:
A 5nm 3.4GHz Tri-Gear ARMv9 CPU Subsystem in a Fully Integrated 5G Flagship Mobile SoC. ISSCC 2022: 50-52- 2021
- [c3]HsinChen Chen, Rolf Lagerquist, Ashish Nayak, Hugh Mair, Gokulakrishnan Manoharan, Ericbill Wang, Gordon Gammie, Efron Ho, Anand Rajagopalan, Lee-Kee Yong, Ramu Madhavaram, Madhur Jagota, Chi-Jui Chung, Sudhakar Maruthi, Jenny Wiedemeier, Tao Chen, Henry Hsieh, Daniel Dia, Amjad Sikiligiri, Manzur Rahman, Barry Chen, Curtis Lin, Vincent Lin, Elly Chiang, Cheng-Yuh Wu, Po-Yang Hsu, Jason Tsai, Wade Wu, Achuta Thippana, S. A. Huang:
A 7nm 5G Mobile SoC Featuring a 3.0GHz Tri-Gear Application Processor Subsystem. ISSCC 2021: 54-56 - [c2]Bo-Jr Huang, Eric Jia-Wei Fang, Sung S.-Y. Hsueh, Rory Huang, Angus Lin, Chi-Hsun Chiang, Yi-Hsuan Lin, Wen-Wen Hsieh, Barry Chen, Yi-Chang Zhuang, Cheng-Yuh Wu, Jia-Ming Chen, Y. S. Chen, Cheng-Tien Wan, Ericbill Wang, Alex Chiou, Ping Kao, Yuwen Tsai, Harry H. Chen, Shih-Arn Hwang:
35.1 An Octa-Core 2.8/2GHz Dual-Gear Sensor-Assisted High-Speed and Power-Efficient CPU in 7nm FinFET 5G Smartphone SoC. ISSCC 2021: 490-492
2010 – 2019
- 2017
- [c1]Hugh Mair, Ericbill Wang, Alice Wang, Ping Kao, Yuwen Tsai, Sumanth Gururajarao, Rolf Lagerquist, Jin Son, Gordon Gammie, Gordon Lin, Achuta Thippana, Kent Li, Manzur Rahman, Wuan Kuo, David Yen, Yi-Chang Zhuang, Ue Fu, Hung-Wei Wang, Mark Peng, Cheng-Yuh Wu, Taner Dosluoglu
, Anatoly Gelman, Daniel Dia, Girishankar Gurumurthy, Tony Hsieh, W. X. Lin, Ray Tzeng, Jengding Wu, C. H. Wang, Uming Ko:
3.4 A 10nm FinFET 2.8GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance. ISSCC 2017: 56-57
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