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Sheriff Sadiqbatcha
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2020 – today
- 2023
- [j12]Jinwei Zhang, Sheriff Sadiqbatcha, Liang Chen, Cuong Thi, Sachin Sachdeva, Hussam Amrouch, Sheldon X.-D. Tan:
Hot-spot aware thermoelectric array based cooling for multicore processors. Integr. 89: 73-82 (2023) - [j11]Jinwei Zhang, Sheriff Sadiqbatcha, Sheldon X.-D. Tan:
Hot-Trim: Thermal and Reliability Management for Commercial Multicore Processors Considering Workload Dependent Hot Spots. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(7): 2290-2302 (2023) - 2022
- [j10]Sheriff Sadiqbatcha, Jinwei Zhang, Hussam Amrouch, Sheldon X.-D. Tan:
Real-Time Full-Chip Thermal Tracking: A Post-Silicon, Machine Learning Perspective. IEEE Trans. Computers 71(6): 1411-1424 (2022) - [j9]Jinwei Zhang, Sheriff Sadiqbatcha, Michael O'Dea, Hussam Amrouch, Sheldon X.-D. Tan:
Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors Under Heat Sink Cooling. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(5): 1453-1466 (2022) - [j8]Liang Chen, Sheriff Sadiqbatcha, Hussam Amrouch, Sheldon X.-D. Tan:
Electrothermal Simulation and Optimal Design of Thermoelectric Cooler Using Analytical Approach. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(9): 3066-3077 (2022) - 2021
- [b1]Sheriff Sadiqbatcha:
Towards Addressing Thermal and Reliability Challenges in Nanometer Integrated Circuits. University of California, Riverside, USA, 2021 - [j7]Sheriff Sadiqbatcha, Jinwei Zhang, Hengyang Zhao, Hussam Amrouch, Jörg Henkel, Sheldon X.-D. Tan:
Post-Silicon Heat-Source Identification and Machine-Learning-Based Thermal Modeling Using Infrared Thermal Imaging. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40(4): 694-707 (2021) - [c12]Wentian Jin, Liang Chen, Sheriff Sadiqbatcha, Shaoyi Peng, Sheldon X.-D. Tan:
EMGraph: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnect Using Graph Convolution Networks. DAC 2021: 919-924 - 2020
- [j6]Sheldon X.-D. Tan, Zeyu Sun, Sheriff Sadiqbatcha:
Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip. IPSJ Trans. Syst. LSI Des. Methodol. 13: 42-55 (2020) - [j5]Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan:
Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39(4): 885-894 (2020) - [c11]Sheriff Sadiqbatcha, Yue Zhao, Jinwei Zhang, Hussam Amrouch, Jörg Henkel, Sheldon X.-D. Tan:
Machine Learning Based Online Full-Chip Heatmap Estimation. ASP-DAC 2020: 229-234 - [c10]Jinwei Zhang, Sheriff Sadiqbatcha, Wentian Jin, Sheldon X.-D. Tan:
Accurate Power Density Map Estimation for Commercial Multi-Core Microprocessors. DATE 2020: 1085-1090 - [c9]Wentian Jin, Sheriff Sadiqbatcha, Jinwei Zhang, Sheldon X.-D. Tan:
Full-Chip Thermal Map Estimation for Commercial Multi-Core CPUs with Generative Adversarial Learning. ICCAD 2020: 14:1-14:9 - [c8]Wentian Jin, Sheriff Sadiqbatcha, Zeyu Sun, Han Zhou, Sheldon X.-D. Tan:
EM-GAN: Data-Driven Fast Stress Analysis for Multi-Segment Interconnects. ICCD 2020: 296-303 - [c7]Jinwei Zhang, Sheriff Sadiqbatcha, Yuanqi Gao, Michael O'Dea, Nanpeng Yu, Sheldon X.-D. Tan:
HAT-DRL: Hotspot-Aware Task Mapping for Lifetime Improvement of Multicore System using Deep Reinforcement Learning. MLCAD 2020: 77-82 - [i1]Wentian Jin, Sheriff Sadiqbatcha, Jinwei Zhang, Sheldon X.-D. Tan:
EM-GAN: Fast Stress Analysis for Multi-Segment Interconnect Using Generative Adversarial Networks. CoRR abs/2004.13181 (2020)
2010 – 2019
- 2019
- [j4]Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan:
Reliability based hardware Trojan design using physics-based electromigration models. Integr. 66: 9-15 (2019) - [j3]Han Zhou, Zeyu Sun, Sheriff Sadiqbatcha, Naehyuck Chang, Sheldon X.-D. Tan:
EM-Aware and Lifetime-Constrained Optimization for Multisegment Power Grid Networks. IEEE Trans. Very Large Scale Integr. Syst. 27(4): 940-953 (2019) - [j2]Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan:
Saturation-Volume Estimation for Multisegment Copper Interconnect Wires. IEEE Trans. Very Large Scale Integr. Syst. 27(7): 1666-1674 (2019) - [c6]Sheriff Sadiqbatcha, Hengyang Zhao, Hussam Amrouch, Jörg Henkel, Sheldon X.-D. Tan:
Hot Spot Identification and System Parameterized Thermal Modeling for Multi-Core Processors Through Infrared Thermal Imaging. DATE 2019: 48-53 - 2018
- [j1]Sheriff Sadiqbatcha, Saeed Jafarzadeh, Yiannis Ampatzidis:
Particle Swarm Optimization for Solving a Class of Type-1 and Type-2 Fuzzy Nonlinear Equations. J. Artif. Intell. Soft Comput. Res. 8(2): 103-110 (2018) - [c5]Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan:
Accelerating electromigration aging for fast failure detection for nanometer ICs. ASP-DAC 2018: 623-630 - [c4]Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan:
Reliability Based Hardware Trojan Design Using Physics-Based Electromigration Models. SMACD 2018: 5-8 - [c3]Sheriff Sadiqbatcha, Chase Cook, Zeyu Sun, Sheldon X.-D. Tan:
Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires. SMACD 2018: 21-24 - 2017
- [c2]Sheriff Sadiqbatcha, Saeed Jafarzadeh, Yiannis Ampatzidis:
Particle swarm optimization for solving a class of type-1 and type-2 fuzzy nonlinear equations. FUZZ-IEEE 2017: 1-5 - 2016
- [c1]Sheriff Sadiqbatcha, Saeed Jafarzadeh:
An analytical approach for solving type-1 and type-2 fully fuzzy linear systems of equations. FUZZ-IEEE 2016: 453-460
Coauthor Index
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