
Vincenzo d'Alessandro
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2010 – 2019
- 2018
- [j13]Lorenzo Codecasa, Robin Bornoff, James Dyson, Vincenzo d'Alessandro
, Alessandro Magnani
, Niccolò Rinaldi:
Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources. Microelectron. Reliab. 87: 194-205 (2018) - [j12]Brice Rogié
, Lorenzo Codecasa, Eric Monier-Vinard
, Valentin Bissuel, Najib Laraqi
, Olivier Daniel, Dario D'Amore, Alessandro Magnani
, Vincenzo d'Alessandro
, Niccolò Rinaldi:
Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization. Microelectron. Reliab. 87: 222-231 (2018) - 2017
- [j11]Vincenzo d'Alessandro
, Antonio Pio Catalano, Alessandro Magnani
, Lorenzo Codecasa
, Niccolò Rinaldi, Brian Moser, Peter J. Zampardi:
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies. Microelectron. Reliab. 78: 233-242 (2017) - [j10]Lorenzo Codecasa
, Vincenzo d'Alessandro, Alessandro Magnani
, Niccolò Rinaldi, Andre G. Metzger, Robin Bornoff, John Parry:
Partition-based approach to parametric dynamic compact thermal modeling. Microelectron. Reliab. 79: 361-370 (2017) - [j9]Lorenzo Codecasa
, Vincenzo d'Alessandro, Alessandro Magnani
, Niccolò Rinaldi:
3-D thermal models calibration by parametric dynamic compact thermal models. Microelectron. Reliab. 79: 371-379 (2017) - [j8]Pascal Chevalier
, Michael Schröter, Colombo R. Bolognesi, Vincenzo d'Alessandro, Maria Alexandrova, Josef Bock, Ralf Flickiger, Sébastien Fregonese, Bernd Heinemann, C. Jungemann, Rickard Lovblom, Cristell Maneux
, Olivier Ostinelli, Andreas Pawlak, Niccolò Rinaldi, Holger Rücker, Gerald Wedel, Thomas Zimmer:
Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications. Proc. IEEE 105(6): 1035-1050 (2017) - [c2]Antonio Pio Catalano, Michele Riccio, Lorenzo Codecasa, Alessandro Magnani
, G. Romano, Vincenzo d'Alessandro, Luca Maresca, Nils Rinaldi, Giovanni Breglio, Andrea Irace:
Model-Order Reduction Procedure for Fast Dynamic Electrothermal Simulation of Power Converters. ApplePies 2017: 81-87 - 2016
- [j7]Vincenzo d'Alessandro
, Alessandro Magnani
, Lorenzo Codecasa
, Niccolò Rinaldi, Klaus Aufinger:
Advanced thermal simulation of SiGe: C HBTs including back-end-of-line. Microelectron. Reliab. 67: 38-45 (2016) - 2015
- [j6]Lorenzo Codecasa
, Vincenzo d'Alessandro, Alessandro Magnani
, Niccolò Rinaldi:
Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction. Microelectron. J. 46(12): 1129-1137 (2015) - [j5]Thomas Jacquet
, Grazia Sasso, Anjan Chakravorty, Niccolò Rinaldi, Klaus Aufinger, Thomas Zimmer, Vincenzo d'Alessandro, Cristell Maneux
:
Reliability of high-speed SiGe: C HBT under electrical stress close to the SOA limit. Microelectron. Reliab. 55(9-10): 1433-1437 (2015) - 2014
- [j4]Michele Riccio
, Vincenzo d'Alessandro
, Andrea Irace, Gilles Rostaing, Mounira Berkani, Stéphane Lefebvre, Philippe Dupuy:
3-D electrothermal simulation of active cycling on smart power MOSFETs during short-circuit and UIS conditions. Microelectron. Reliab. 54(9-10): 1845-1850 (2014) - 2013
- [j3]Andre G. Metzger, Vincenzo d'Alessandro
, Niccolò Rinaldi
, Peter J. Zampardi:
Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers. Microelectron. Reliab. 53(9-11): 1471-1475 (2013) - [j2]Vincenzo d'Alessandro
, Alessandro Magnani
, Michele Riccio
, Yohei Iwahashi, Giovanni Breglio
, Niccolò Rinaldi
, Andrea Irace:
Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations. Microelectron. Reliab. 53(9-11): 1713-1718 (2013) - [c1]Alessandro Magnani
, Vincenzo d'Alessandro
, Niccolò Rinaldi
, Massimiliano de Magistris, Klaus Aufinger:
Dynamic electrothermal macromodeling techniques for thermal-aware design of circuits and systems. PATMOS 2013: 227-230 - 2012
- [j1]Ana Villamor-Baliarda, Piet Vanmeerbeek, Michele Riccio
, Vincenzo d'Alessandro
, Andrea Irace, Jaume Roig, David Flores, Peter Moens:
Influence of charge balance on the robustness of trench-based super junction diodes. Microelectron. Reliab. 52(9-10): 2409-2413 (2012)
Coauthor Index

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