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"Simulation comparison of InGaP/GaAs HBT thermal performance in ..."

Vincenzo d'Alessandro et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.09.011

access: closed

type: Journal Article

metadata version: 2023-09-30

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Vincenzo d'Alessandro, Antonio Pio Catalano, Alessandro Magnani, Lorenzo Codecasa, Niccolò Rinaldi, Brian Moser, Peter J. Zampardi:
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies. Microelectron. Reliab. 78: 233-242 (2017)

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