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ORCIDLeo J. Ernst
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2010 – 2019
- 2012
[j19]M. Sadeghinia, Kaspar M. B. Jansen
, Leo J. Ernst:
Characterization of the viscoelastic properties of an epoxy molding compound during cure. Microelectron. Reliab. 52(8): 1711-1718 (2012)- 2010
- [j18]Jan de Vreugd, Kaspar M. B. Jansen, Leo J. Ernst, C. Bohm:
Prediction of cure induced warpage of micro-electronic products. Microelectron. Reliab. 50(7): 910-916 (2010) - [j17]Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont:
A fast moisture sensitivity level qualification method. Microelectron. Reliab. 50(9-11): 1654-1660 (2010)
2000 – 2009
- 2009
- [j16]Kaspar M. B. Jansen, C. Qian, Leo J. Ernst, C. Bohm, A. Kessler, Harald Preu, Matthias Stecher:
Modeling and characterization of molding compound properties during cure. Microelectron. Reliab. 49(8): 872-876 (2009) - 2007
- [j15]Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen:
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. Microelectron. Reliab. 47(2-3): 233-239 (2007) - [j14]C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, Dao-Guo Yang, G. Q. Zhang, H. J. L. Bressers:
Novel shear tools for viscoelastic characterization of packaging polymers. Microelectron. Reliab. 47(2-3): 240-247 (2007) - [j13]Viktor Gonda, Kaspar M. B. Jansen, Leo J. Ernst, Jaap M. J. den Toonder, G. Q. Zhang:
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques. Microelectron. Reliab. 47(2-3): 248-251 (2007) - [j12]H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang:
Correlation between chemistry of polymer building blocks and microelectronics reliability. Microelectron. Reliab. 47(2-3): 290-294 (2007) - [j11]Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen:
Numerical modeling of warpage induced in QFN array molding process. Microelectron. Reliab. 47(2-3): 310-318 (2007) - [j10]Cadmus A. Yuan, Olaf van der Sluis, G. Q. (Kouchi) Zhang, Leo J. Ernst, Willem D. van Driel, Richard B. R. van Silfhout:
Molecular simulation on the material/interfacial strength of the low-dielectric materials. Microelectron. Reliab. 47(9-11): 1483-1491 (2007) - [j9]Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang:
Characterization of moisture properties of polymers for IC packaging. Microelectron. Reliab. 47(9-11): 1685-1689 (2007) - [j8]M. van Soestbergen, Leo J. Ernst, Kaspar M. B. Jansen, W. D. van Driel:
Measuring the through-plane elastic modulus of thin polymer films in situ. Microelectron. Reliab. 47(12): 1983-1988 (2007) - [j7]Tomasz Falat, Artur Wymyslowski, Jana Kolbe, Kaspar M. B. Jansen, Leo J. Ernst:
Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach. Microelectron. Reliab. 47(12): 1989-1996 (2007) - 2006
- [j6]Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, Roy A. B. Engelen, Leo J. Ernst, Fred van Keulen, G. Q. Zhang:
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectron. Reliab. 46(9-11): 1679-1684 (2006) - 2004
- [j5]Dao-Guo Yang, J. S. Liang, Quan-Yong Li, Leo J. Ernst, G. Q. Zhang:
Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach. Microelectron. Reliab. 44(12): 1947-1955 (2004) - [j4]Y. T. He, Marcel A. J. van Gils, Willem D. van Driel, G. Q. Zhang, Richard B. R. van Silfhout, Leo J. Ernst:
Prediction of crack growth in IC passivation layers. Microelectron. Reliab. 44(12): 2003-2009 (2004) - [j3]Viktor Gonda, Jaap M. J. den Toonder, Johan Beijer, G. Q. Zhang, Willem D. van Driel, Romano J. O. M. Hoofman, Leo J. Ernst:
Prediction of thermo-mechanical integrity of wafer backend processes. Microelectron. Reliab. 44(12): 2011-2017 (2004) - [j2]Willem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, Marcel A. J. van Gils, Leo J. Ernst:
Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. Microelectron. Reliab. 44(12): 2019-2027 (2004) - 2003
- [j1]W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi:
Prediction and verification of process induced warpage of electronic packages. Microelectron. Reliab. 43(5): 765-774 (2003)
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