Moongon Jung

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with David Z. Pan

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Publications

2014
[j3]
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Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim:
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC. Commun. ACM 57(1): 107-115 (2014)
2013
[j2]
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Moongon Jung, David Z. Pan, Sung Kyu Lim:
Chip/Package Mechanical Stress Impact on 3-D IC Reliability and Mobility Variations. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(11): 1694-1707 (2013)
2012
[j1]
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Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim:
TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31(8): 1194-1207 (2012)
[c7]
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  - conf/aspdac/PanLAJMPPY12
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David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang:
Design for manufacturability and reliability for TSV-based 3D ICs. ASP-DAC 2012: 750-755
[c6]
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Moongon Jung, David Z. Pan, Sung Kyu Lim:
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs. DAC 2012: 317-326
2011
[c4]
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Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim:
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC. DAC 2011: 188-193
[c3]
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  - conf/iccad/JungLSPL11
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Moongon Jung, Xi Liu, Suresh K. Sitaraman, David Z. Pan, Sung Kyu Lim:
Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC. ICCAD 2011: 563-570

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