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"Design for manufacturability and reliability for TSV-based 3D ICs."
David Z. Pan et al. (2012)
- David Z. Pan, Sung Kyu Lim
, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang:
Design for manufacturability and reliability for TSV-based 3D ICs. ASP-DAC 2012: 750-755
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