"Chip/package co-analysis of thermo-mechanical stress and reliability in ..."

Moongon Jung, David Z. Pan, Sung Kyu Lim (2012)

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DOI: 10.1145/2228360.2228419

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Moongon Jung, David Z. Pan, Sung Kyu Lim:
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs. DAC 2012: 317-326

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