"Thermal Via Allocation for 3-D ICs Considering Temporally and Spatially ..."

Hao Yu et al. (2008)

> Home

Details and statistics

DOI: 10.1109/TVLSI.2008.2001297

access: closed

type: Journal Article

metadata version: 2022-12-13

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tvlsi/YuSHK08
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tvlsi/YuSHK08
Hao Yu, Yiyu Shi, Lei He, Tanay Karnik:
Thermal Via Allocation for 3-D ICs Considering Temporally and Spatially Variant Thermal Power. IEEE Trans. Very Large Scale Integr. Syst. 16(12): 1609-1619 (2008)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.