"Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICs."

Shengcheng Wang, Mehdi Baradaran Tahoori (2017)

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DOI: 10.1109/TVLSI.2017.2716821

access: closed

type: Journal Article

metadata version: 2020-03-11

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  - https://dblp.org/rec/journals/tvlsi/WangT17
Shengcheng Wang, Mehdi Baradaran Tahoori:
Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 25(10): 2881-2892 (2017)

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