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"Mechanical Reliability of Silicon Wafers with Through-Wafer Vias for ..."

Alexander Polyakov, Marian Bartek, Joachim N. Burghartz (2002)

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DOI: 10.1016/S0026-2714(02)00231-7

access: closed

type: Journal Article

metadata version: 2020-02-22

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Alexander Polyakov, Marian Bartek, Joachim N. Burghartz:
Mechanical Reliability of Silicon Wafers with Through-Wafer Vias for Wafer-Level Packaging. Microelectron. Reliab. 42(9-11): 1783-1788 (2002)

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