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"LOTS: Low Overhead TSV Repair Method Using IEEE-1838 Standard Architecture."

Sunghoon Kim et al. (2023)

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DOI: 10.1109/ISOCC59558.2023.10395943

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-27

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  dblp key:
  - conf/isocc/KimHJK23
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Sunghoon Kim, Donghyun Han, Seokjun Jang, Sungho Kang:
LOTS: Low Overhead TSV Repair Method Using IEEE-1838 Standard Architecture. ISOCC 2023: 289-290

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