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"Thermal-Aware Placement and Routing for 3D Optical Networks-on-Chips."

Fengxian Jiao et al. (2018)

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DOI: 10.1109/ISCAS.2018.8351101

access: closed

type: Conference or Workshop Paper

metadata version: 2019-09-16

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  dblp key:
  - conf/iscas/JiaoDY0S18
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  - https://dblp.org/rec/conf/iscas/JiaoDY0S18
Fengxian Jiao, Sheqin Dong, Bei Yu, Bing Li, Ulf Schlichtmann:
Thermal-Aware Placement and Routing for 3D Optical Networks-on-Chips. ISCAS 2018: 1-4

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