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"Scenario for catastrophic failure in interconnect structures under chip ..."
Masaki Omiya et al. (2015)
- Masaki Omiya, Shoji Kamiya, Nobuyuki Shishido, Kozo Koiwa, Hisashi Sato, Masahiro Nishida
, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo:
Scenario for catastrophic failure in interconnect structures under chip package interaction. IRPS 2015: 5
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