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ORCIDHua Lu 0003
Person information
- affiliation: Forecast Foundation, San Francisco, CA, USA
Other persons with the same name
- Hua Lu 0001
![[0000-0003-1199-6678]](https://dblp.uni-trier.de/img/orcid-mark.12x12.png "0000-0003-1199-6678")
— Roskilde University, Denmark (and 2 more) - Hua Lu 0002 — CSIRO Land and Water, Canberra, ACT, Australia
- Hua Lu 0004 — Tongji University, Shanghai, China
- Hua Lu 0005 — University of Guelph, Guelph, Ontario, Canada
- Hua Lu 0006 — Ryerson University, Toronto, Canada
- Hua Lu 0007 — University of Electronic Science and Technology, Chengdu, China
- Hua Lu 0008 — Hubei University of Technology, School of Sciences, Wuhan, China (and 1 more)
- Hua Lu 0009 — Université Bretagne Loire, Rennes, France
- Hua Lu 0010 — Beijing Wuzi University, Logistics School, China
- Hua Lu 0011 — Anhui Polytechnic University, Wuhu, China
- Hua Lu 0012 — Guangdong Communications & Networks Institute, China
- Hua Lu 0013 — Shandong Normal University, School of Physics and Electronics, Jinan, China
- Hua Lu 0014 — Baidu Inc., China
- Hua Lu 0015 — Academy of Space Information Systems, Xi'an, China
- Hua Lu 0016 — Chinese Academy of Sciences, Institute of Electronics, State Key Laboratory of Transducer Technology, Beijing, China
- Hua Lu 0017 — Huazhong University of Science and Technology, Wuhan, China
- Hua Lu 0018 — Harbin Institute of Technology, Department of Mechanical Engineering, China
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Journal Articles
- 2018
[j11]Kenneth Chimezie Nwanoro, Hua Lu, Chunyan Yin, Chris Bailey:
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectron. Reliab. 87: 1-14 (2018)- 2017
- [j10]Pushparajah Rajaguru, Hua Lu, Chris Bailey, Jose Angel Ortiz Gonzalez, Olayiwola Alatise:
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectron. Reliab. 68: 77-85 (2017) - 2015
- [j9]Pushparajah Rajaguru, Hua Lu, Chris Bailey:
Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectron. Reliab. 55(6): 919-930 (2015) - [j8]Pushparajah Rajaguru, Hua Lu, Chris Bailey:
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectron. Reliab. 55(11): 2371-2381 (2015) - 2011
- [j7]Xiangdong Xue, Chris Bailey, Hua Lu, Stoyan Stoyanov:
Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectron. Reliab. 51(5): 936-945 (2011) - 2010
- [j6]E. Kamara, Hua Lu, Chris Bailey, Chris Hunt, Davide Di Maio, Owen Thomas:
A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectron. Reliab. 50(9-11): 1706-1710 (2010) - 2009
- [j5]Hua Lu, Chris Bailey, Chunyan Yin:
Design for reliability of power electronics modules. Microelectron. Reliab. 49(9-11): 1250-1255 (2009) - 2008
- [j4]M. J. Rizvi, Chris Bailey, Hua Lu:
Failure mechanisms of ACF joints under isothermal ageing. Microelectron. J. 39(9): 1101-1107 (2008) - 2005
- [j3]M. J. Rizvi, Y. C. Chan, Chris Bailey, Hua Lu:
Study of anisotropic conductive adhesive joint behavior under 3-point bending. Microelectron. Reliab. 45(3-4): 589-596 (2005) - 2003
- [j2]Chunyan Yin, M. O. Alam, Yan Cheong Chan, Chris Bailey, Hua Lu:
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectron. Reliab. 43(4): 625-633 (2003) - 2002
- [j1]Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan:
No-flow underfill flip chip assembly--an experimental and modeling analysis. Microelectron. Reliab. 42(8): 1205-1212 (2002)
Informal and Other Publications
- 2015
- [i1]Hua Lu, Jack Peterson:
False shares in verifiable secret sharing with finite field commitments. CoRR abs/1507.04089 (2015)
Coauthor Index
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