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"No-flow underfill flip chip assembly--an experimental and modeling analysis."
Hua Lu et al. (2002)
- Hua Lu, K. C. Hung, Stoyan Stoyanov
, Chris Bailey
, Y. C. Chan:
No-flow underfill flip chip assembly--an experimental and modeling analysis. Microelectron. Reliab. 42(8): 1205-1212 (2002)
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