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Toni T. Mattila
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2010 – 2019
- 2014
- [j11]Toni T. Mattila, Laura Vajavaara, Jussi Hokka, Esa Hussa, Manu Mäkelä, Ville Halkola:
Evaluation of the drop response of handheld electronic products. Microelectron. Reliab. 54(3): 601-609 (2014) - [j10]Toni T. Mattila, Heikki Ruotoistenmäki, Jani Raami, Jussi Hokka, Manu Mäkelä, Esa Hussa, Markku Sillanpää, Ville Halkola:
An approach to adjust the board-level drop test conditions to improve the correlation with product-level drop impact. Microelectron. Reliab. 54(4): 785-795 (2014) - [j9]Jue Li, Mikael Broas, Jani Raami, Toni T. Mattila, Mervi Paulasto-Kröckel:
Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading. Microelectron. Reliab. 54(6-7): 1228-1234 (2014) - 2012
- [j8]Toni T. Mattila, Jue Li, Jorma K. Kivilahti:
On the effects of temperature on the drop reliability of electronic component boards. Microelectron. Reliab. 52(1): 165-179 (2012) - [j7]Juha Karppinen, Jue Li, J. Pakarinen, Toni T. Mattila, Mervi Paulasto-Kröckel:
Shock impact reliability characterization of a handheld product in accelerated tests and use environment. Microelectron. Reliab. 52(1): 190-198 (2012) - [j6]Jussi Hokka, Jue Li, Toni T. Mattila, Mervi Paulasto-Kröckel:
The reliability of component boards studied with different shock impact repetition frequencies. Microelectron. Reliab. 52(7): 1445-1453 (2012) - 2011
- [j5]Toni T. Mattila, Mervi Paulasto-Kröckel:
Toward comprehensive reliability assessment of electronics by a combined loading approach. Microelectron. Reliab. 51(6): 1077-1091 (2011) - 2010
- [j4]Jussi Hokka, Toni T. Mattila, Jue Li, Jarmo Teeri, Jorma K. Kivilahti:
A novel impact test system for more efficient reliability testing. Microelectron. Reliab. 50(8): 1125-1133 (2010) - [j3]Juha Karppinen, Jue Li, Toni T. Mattila, Mervi Paulasto-Kröckel:
Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment. Microelectron. Reliab. 50(12): 1994-2000 (2010) - [j2]J. Li, Toni T. Mattila, H. Xu, Mervi Paulasto:
FEM simulations for reliability assessment of component boards drop tested at various temperatures. Simul. Model. Pract. Theory 18(9): 1355-1364 (2010)
2000 – 2009
- 2007
- [j1]Tomi Laurila, Toni T. Mattila, Vesa Vuorinen, Juha Karppinen, Jue Li, Mika Sippola, Jorma K. Kivilahti:
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests. Microelectron. Reliab. 47(7): 1135-1144 (2007)
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