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Hyun-Suk Chun

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Journal Articles

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2008
[j1]
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  - journals/mr/YoonCNKKLJ08
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  - https://dblp.org/rec/journals/mr/YoonCNKKLJ08
Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung:
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. Microelectron. Reliab. 48(11-12): 1857-1863 (2008)

Informal and Other Publications

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2007
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  - journals/corr/abs-0711-3323
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Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung:
Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications. CoRR abs/0711.3323 (2007)

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