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M. L. Nai

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Journal Articles

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2003
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Jun Wei, F. L. Ng, M. L. Nai, H. Xie, Peck Cheng Lim, C. K. Wong:
Wafer Bonding Process Based On The Taguchi Analysis. Int. J. Comput. Eng. Sci. 4(2): 331-334 (2003)
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W. B. Yu, Jun Wei, Cher Ming Tan, S. S. Deng, M. L. Nai:
Influence Of Applied Load On Wafer Bonding In Vacuum. Int. J. Comput. Eng. Sci. 4(2): 351-354 (2003)
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S. S. Deng, Jun Wei, Cher Ming Tan, M. L. Nai, W. B. Yu, H. Xie:
Low Temperature Silicon Wafer Bonding By Sol-Gel Processing. Int. J. Comput. Eng. Sci. 4(3): 655-658 (2003)

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