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"Low Temperature Silicon Wafer Bonding By Sol-Gel Processing."

S. S. Deng et al. (2003)

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DOI: 10.1142/S1465876303001976

access: closed

type: Journal Article

metadata version: 2020-07-09

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  - journals/ijces/DengWTNYX03
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  - https://dblp.org/rec/journals/ijces/DengWTNYX03
S. S. Deng, Jun Wei, Cher Ming Tan, M. L. Nai, W. B. Yu, H. Xie:
Low Temperature Silicon Wafer Bonding By Sol-Gel Processing. Int. J. Comput. Eng. Sci. 4(3): 655-658 (2003)

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