"Influence Of Applied Load On Wafer Bonding In Vacuum."

W. B. Yu et al. (2003)

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DOI: 10.1142/S1465876303001253

access: closed

type: Journal Article

metadata version: 2020-07-09

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W. B. Yu, Jun Wei, Cher Ming Tan, S. S. Deng, M. L. Nai:
Influence Of Applied Load On Wafer Bonding In Vacuum. Int. J. Comput. Eng. Sci. 4(2): 351-354 (2003)

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