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C. S. Selvanayagam

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2010 – 2019

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2016
[j2]
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  - journals/mr/WongCSS16
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Ee-Hua Wong, J. Chrisp, C. S. Selvanayagam, S. K. W. Seah:
Constitutive modeling of solder alloys for drop-impact applications. Microelectron. Reliab. 67: 135-142 (2016)
2011
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  - conf/3dic/ZhangRCSCGLK11
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Xiaowu Zhang, Ranjan Rajoo, F. X. Che, C. S. Selvanayagam, W. K. Choi, Shan Gao, Guo-Qiang Lo, Dim-Lee Kwong:
A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications. 3DIC 2011: 1-5

2000 – 2009

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2008
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Ee-Hua Wong, Ranjan Rajoo, S. K. W. Seah, C. S. Selvanayagam, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, M. Leoni, P. L. Eu, Y.-S. Lai, C.-L. Yeh:
Correlation studies for component level ball impact shear test and board level drop test. Microelectron. Reliab. 48(7): 1069-1078 (2008)

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