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J. H. J. Janssen

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2018
[j8]
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  - journals/access/AslanPJGRY18
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  - https://dblp.org/rec/journals/access/AslanPJGRY18
Yanki Aslan, Jan Puskely, J. H. J. Janssen, Marcel Geurts, Antoine Roederer, Alexander Yarovoy:
Thermal-Aware Synthesis of 5G Base Station Antenna Arrays: An Overview and a Sparsity-Based Approach. IEEE Access 6: 58868-58882 (2018)
2008
[j7]
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  - journals/mr/KoningLSSJ08
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  - https://dblp.org/rec/journals/mr/KoningLSSJ08
J. J. Koning, S. Lecaudey, E. Spaan, M. Stoutjesdijk, J. H. J. Janssen:
Thermal heating within SOI. Microelectron. Reliab. 48(8-9): 1505-1508 (2008)
2007
[j6]
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  - journals/mr/GilsSZJV07
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  - https://dblp.org/rec/journals/mr/GilsSZJV07
Marcel A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken:
Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectron. Reliab. 47(2-3): 179-186 (2007)
[j5]
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  - journals/mr/YangJEZBJ07
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Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen:
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. Microelectron. Reliab. 47(2-3): 233-239 (2007)
[j4]
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  - journals/mr/GilsDZBSFJ07
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  - https://dblp.org/rec/journals/mr/GilsDZBSFJ07
Marcel A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen:
Virtual qualification of moisture induced failures of advanced packages. Microelectron. Reliab. 47(2-3): 273-279 (2007)
[j3]
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  - journals/mr/YangJEZDBJ07
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Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen:
Numerical modeling of warpage induced in QFN array molding process. Microelectron. Reliab. 47(2-3): 310-318 (2007)
2004
[j2]
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  - journals/mr/DrielLZJSGE04
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  - https://dblp.org/rec/journals/mr/DrielLZJSGE04
Willem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, Marcel A. J. van Gils, Leo J. Ernst:
Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. Microelectron. Reliab. 44(12): 2019-2027 (2004)
2003
[j1]
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  - journals/mr/DrielZJESCY03
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  - https://dblp.org/rec/journals/mr/DrielZJESCY03
W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi:
Prediction and verification of process induced warpage of electronic packages. Microelectron. Reliab. 43(5): 765-774 (2003)

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