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R. M. J. Voncken

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2007
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Marcel A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken:
Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectron. Reliab. 47(2-3): 179-186 (2007)

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