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K. K. Jinka

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Journal Articles

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2009
[j2]
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K. K. Jinka, A. Dasgupta, S. Ganesan, S. Ling:
Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires. Microelectron. Reliab. 49(5): 523-529 (2009)
2007
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K. K. Jinka, S. Ganesan, A. Dasgupta, S. Ling, Andrew A. Shapiro, D. Schatzel:
Chip-on-Board (CoB) technology for low temperature environments. Part I: Wire profile modeling in unencapsulated chips. Microelectron. Reliab. 47(8): 1246-1250 (2007)

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