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"Chip-on-Board (CoB) technology for low temperature environments. Part I: ..."
K. K. Jinka et al. (2007)
- K. K. Jinka, S. Ganesan, A. Dasgupta, S. Ling, Andrew A. Shapiro, D. Schatzel:
Chip-on-Board (CoB) technology for low temperature environments. Part I: Wire profile modeling in unencapsulated chips. Microelectron. Reliab. 47(8): 1246-1250 (2007)
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