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Conference and Workshop Papers
- 2019
[c9]Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt:
Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration. 3DIC 2019: 1-5- [c8]Norman Dodel, Roland Thewes, Anouar Laifi, Dirk Eberhardt, Stefan Keil, Leonhard Sturm, Armin Klumpp, Oliver Freudenberg, Friedel Gerfers, Gerhard Hartwich:
A CMOS-Based Electrochemical DNA Hybridization Microarray for Diagnostic Applications with 109 Test Sites. BioCAS 2019: 1-4 - 2017
- [c7]Rita Siris, Jamila Boudaden, Armin Klumpp:
Photoelectrochemical nitrate sensor utilizing Cu/Pd nanoparticles on TiO2-nanoparticles carrier: Combination of catalytic and photocatalytic mechanism. IEEE SENSORS 2017: 1-3 - 2016
- [c6]Montserrat Fernandez-Bolaños, Wolfgang A. Vitale, Mariazel Maqueda Lopez, Adrian M. Ionescu, Armin Klumpp, Karl-Reinhard Merkel, Josef Weber, Peter Ramm, Ilja Ocket, Walter De Raedt
, Amin Enayati:
3D TSV based high frequency components for RF IC and RF MEMS applications. 3DIC 2016: 1-4 - [c5]Jamila Boudaden, Armin Klumpp, Ignaz Eisele, Christoph Kutter:
Smart capacitive CO2 sensor. IEEE SENSORS 2016: 1-3 - 2010
- [c4]Ladislav Andricek, Michael Beimforde, Armin Klumpp, Anna Macchiolo, Karl-Reinhard Merkel, Hans-Günther Moser, Richard Nisius, Rainer Helmut Richter, Josef Weber, Philipp Weigell, Robert Wieland:
Application of the SLID-ICV interconnection technology for the ATLAS pixel upgrade at SLHC. 3DIC 2010: 1-4 - [c3]Harry Hedler, Thomas Scheiter, Markus Schieber, Armin Klumpp, Peter Ramm:
High performance 3D interconnects based on electrochemical etch and liquid metal fill. 3DIC 2010: 1-7 - [c2]Armin Klumpp, Peter Ramm, Robert Wieland:
3D-integration of silicon devices: A key technology for sophisticated products. DATE 2010: 1678-1683 - [c1]Peter Ramm, Armin Klumpp, Josef Weber, Nicolas Lietaer, Maaike Taklo, Walter De Raedt, Thomas Fritzsch, Pascal Couderc:
3D Integration technology: Status and application development. ESSCIRC 2010: 9-16
Informal and Other Publications
- 2008
- [i1]Jürgen Wolf, Peter Ramm, Armin Klumpp, Herbert Reichl:
Technologies for 3D Heterogeneous Integration. CoRR abs/0805.0917 (2008)
Coauthor Index
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