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Le Hac Huong Thu

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2022
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Takashi Matsumae, Shingo Kariya, Yuichi Kurashima, Le Hac Huong Thu, Eiji Higurashi, Masanori Hayase, Hideki Takagi:
Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging. Sensors 22(21): 8144 (2022)

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