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"Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer ..."

Takashi Matsumae et al. (2022)

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DOI: 10.3390/S22218144

access: open

type: Journal Article

metadata version: 2022-12-05

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Takashi Matsumae, Shingo Kariya, Yuichi Kurashima, Le Hac Huong Thu, Eiji Higurashi, Masanori Hayase, Hideki Takagi:
Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging. Sensors 22(21): 8144 (2022)

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