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ORCIDAlaa B. El-Rouby
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- affiliation: Cairo University, Electronics and Communication Engineering Department, Egypt
- affiliation: Mentor Graphics, Cairo, Egypt
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2010 – 2019
- 2015
[j2]Karim Ali, Eslam Yahya, Alaa B. El-Rouby, Yehea I. Ismail:
Library based macro-modeling methodology for Through Silicon Via (TSV) arbitrary arrays. Microelectron. J. 46(12): 1291-1303 (2015)- [c9]Kareem Ali, Eslam Yahya, Alaa B. El-Rouby, Yehea Ismail:
Different scenarios for estimating coupling capacitances of through silicon via (TSV) arrays. ICEAC 2015: 1-4 - 2013
- [c8]Mohamed Mahmoud, Amr Wassal, Alaa B. El-Rouby, Rafik Guindi:
Current source based standard-cell model for accurate timing analysis of combinational logic cells. ICECS 2013: 281-284 - [c7]Khaled Salah
, Alaa B. El-Rouby, Hani F. Ragai, Yehea I. Ismail:
TSV-based on-chip inductive coupling communications. ISCAS 2013: 1672-1675 - 2012
- [j1]Shaymaa M. Nabil, Alaa B. El-Rouby, Ahmed H. Khalil:
An accurate power delivery system (PDS) design methodology for high-speed digital systems. Int. J. Circuit Theory Appl. 40(1): 37-47 (2012) - [c6]Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Yehea Ismail:
Effect of non-uniform substrate doping profile on the electrical performance of through-silicon-via for low power application. ICEAC 2012: 1-4 - [c5]Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Yehea I. Ismail:
Modeling and analysis of through silicon via: Electromagnetic and device simulation approach. ICECS 2012: 825-828 - [c4]Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Yehea I. Ismail:
A closed form expression for TSV-based on-chip spiral inductor. ISCAS 2012: 2325-2328 - 2011
- [c3]Khaled Salah, Hani F. Ragai, Yehea I. Ismail, Alaa B. El-Rouby:
Equivalent lumped element models for various n-port Through Silicon Vias networks. ASP-DAC 2011: 176-183 - [c2]Khaled Mohamed, Alaa B. El-Rouby, Yehea I. Ismail, Hani F. Ragai:
Body contact based TSV equalizer. IDT 2011: 114-117 - [c1]Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Karim Amin, Yehea I. Ismail:
Compact lumped element model for TSV in 3D-ICs. ISCAS 2011: 2321-2324
Coauthor Index
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