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Journal Articles
- 2017
[j1]Eiji Higurashi
, Ken Okumura, Yutaka Kunimune, Tadatomo Suga, Kei Hagiwara:
Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method. IEICE Trans. Electron. 100-C(2): 156-160 (2017)
Conference and Workshop Papers
- 2023
- [c4]Kei Hagiwara, Yu Fujimoto, Yasuhiro Kodama, Yasuhiro Hayashi, Ryo Maeda, Kohei Oishi, Kenjiro Mori:
Prioritization of Distribution Networks with Distributed Energy Resources for Efficient Deployment of Loss Minimum Reconfiguration Technology. ISGT Asia 2023: 1-5 - 2019
- [c3]Masahide Goto, Joeri De Vos, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Eiji Higurashi, Yuki Honda, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Toshiro Hiramoto:
Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers. 3DIC 2019: 1-4 - 2018
- [c2]Masahide Goto, Yuki Honda, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto:
Quarter Video Graphics Array Full-Digital Image Sensing with Wide Dynamic Range and Linear Output Using Pixel-Wise 3D Integration. ISCAS 2018: 1-4 - 2015
- [c1]Masahide Goto, Kei Hagiwara, Yoshinori Iguchi, Hiroshi Ohtake, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto:
Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers. 3DIC 2015: TS9.2.1-TS9.2.4
Coauthor Index
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