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Sven Rzepka

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2020 – today

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2023
[c2]
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  - conf/icphm/NuzzoLTRO23
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  - https://dblp.org/rec/conf/icphm/NuzzoLTRO23
Giovanni Di Nuzzo, Horst Lewitschnig, Marc Tuellmann, Sven Rzepka, Alexander Otto:
A Data-driven Condition Monitoring method to predict the Remaining Useful Life of SiC Power Modules for Traction Inverters. ICPHM 2023: 312-319
2021
[c1]
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  - conf/dsd/PresselMRBZDGBS21
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Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt, Susan Zhao, Willem D. van Driel, Paolo Giammatteo, Baris Bulut, Müjdat Soytürk, Luigi Pomante:
The H2020-ECSEL Project "iRel40" (Intelligent Reliability 4.0). DSD 2021: 311-318

2010 – 2019

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2018
[j10]
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  - journals/mr/DudekHRFDSO18
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Rainer Dudek, M. Hildebrand, Sven Rzepka, T. Fries, Ralf Döring, Bettina Seiler, R. W. Ortmann:
Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue. Microelectron. Reliab. 83: 162-172 (2018)
[j9]
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  - journals/mr/AuerspergACDVWR18
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Jürgen Auersperg, Ellen Auerswald, Christian Collet, Thierry Dean, Dietmar Vogel, Thomas Winkler, Sven Rzepka:
Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor. Microelectron. Reliab. 87: 238-244 (2018)
[j8]
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  - journals/mr/ReisRH18
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Daniel Monteiro Diniz Reis, Sven Rzepka, Karla Hiller:
Reliability testing of integrated low-temperature PVD PZT films. Microelectron. Reliab. 88-90: 835-839 (2018)
2016
[j7]
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  - journals/mr/PoshtanRSW16
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Emad A. Poshtan, Sven Rzepka, Christian Silber, Bernhard Wunderle:
An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages. Microelectron. Reliab. 62: 18-25 (2016)
[j6]
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  - journals/mr/VogelAGR16
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Dietmar Vogel, Ellen Auerswald, Gh. Gadhiya, Sven Rzepka:
Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments. Microelectron. Reliab. 64: 276-280 (2016)
2014
[j5]
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  - journals/mr/AuerspergDJBRM14
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Jürgen Auersperg, Rainer Dudek, R. Jordan, O. Bochow-Neß, Sven Rzepka, Bernd Michel:
On the crack and delamination risk optimization of a Si-interposer for LED packaging. Microelectron. Reliab. 54(6-7): 1223-1227 (2014)
[j4]
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  - journals/mr/Schindler-SaefkowROPMWMRK14
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Florian Schindler-Saefkow, Florian Rost, Alexander Otto, R. Pantou, Raul Mroßko, Bernhard Wunderle, Bernd Michel, Sven Rzepka, Jürgen Keller:
Stress impact of moisture diffusion measured with the stress chip. Microelectron. Reliab. 54(6-7): 1243-1252 (2014)
[j3]
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  - journals/mr/VogelAABRZRM14
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Dietmar Vogel, Ellen Auerswald, Jürgen Auersperg, Parisa Bayat, Raul D. Rodriguez, Dietrich R. T. Zahn, Sven Rzepka, Bernd Michel:
Stress analyses of high spatial resolution on TSV and BEoL structures. Microelectron. Reliab. 54(9-10): 1963-1968 (2014)
2013
[j2]
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  - journals/mr/KellerMDSDDRM13
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J. Keller, Raul Mrossko, H. Dobrinski, J. Stürmann, Ralf Döring, Rainer Dudek, Sven Rzepka, Bernd Michel:
Effect of moisture swelling on MEMS packaging and integrated sensors. Microelectron. Reliab. 53(9-11): 1648-1654 (2013)

2000 – 2009

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2004
[j1]
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  - journals/mr/WieseR04
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Steffen Wiese, Sven Rzepka:
Time-independent elastic-plastic behaviour of solder materials. Microelectron. Reliab. 44(12): 1893-1900 (2004)

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