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ORCIDSean M. Carey
- > Home > Persons > Sean M. Carey
Publications
- 2021
[j9]David Wolpert
, Christopher J. Berry, Brian Bell, Adam Jatkowski, Jesse Surprise, John Isakson, Ofer Geva, Brian Deskin, Mark Cichanowski, Dina Hamid, Chris Cavitt, Gregory Fredeman, Dinesh Kannambadi, Anthony Saporito, Ashutosh Mishra, Alper Buyuktosunoglu, Tobias Webel, Preetham Lobo, Ramon Bertran, Pradeep Bhadravati Parashurama, Dureseti Chidambarrao, Brandon Bruen, Alan P. Wagstaff, Eric Lukes, Sean M. Carey, Hunter F. Shi, Michael Romain, Paul Logsdon, Ishita Agarwal:
Cores, Cache, Content, and Characterization: IBM's Second Generation 14-nm Product, z15. IEEE J. Solid State Circuits 56(1): 98-111 (2021)- 2020
- [j8]Christopher J. Berry, David Wolpert, Brian Bell, Adam Jatkowski, Jesse Surprise, Gerald Strevig, John Isakson, Ofer Geva, Brian Deskin, Mark Cichanowski, Giora Biran, Dina Hamid, Chris Cavitt, Gregory Fredeman, Dureseti Chidambarrao, Brandon Bruen, Michael H. Wood, Sean M. Carey, Drew Turner, Leon J. Sigal:
IBM z15: Physical design improvements to significantly increase content in the same technology. IBM J. Res. Dev. 64(5/6): 8:1-8:12 (2020) - 2014
- [j4]James D. Warnock, Yuen H. Chan, Hubert Harrer, Sean M. Carey, Gerard Salem, Doug Malone, Ruchir Puri, Jeffrey A. Zitz, Adam Jatkowski, Gerald Strevig, Ayan Datta, Anne Gattiker, Aditya Bansal, Guenter Mayer, Yiu-Hing Chan, Mark D. Mayo, David L. Rude, Leon J. Sigal, Thomas Strach, Howard H. Smith, Huajun Wen, Pak-kin Mak, Chung-Lung Kevin Shum, Donald W. Plass, Charles F. Webb:
Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module. IEEE J. Solid State Circuits 49(1): 9-18 (2014) - 2013
- [c3]James D. Warnock, Yuen H. Chan, Hubert Harrer, David L. Rude, Ruchir Puri, Sean M. Carey, Gerard Salem, Guenter Mayer, Yiu-Hing Chan, Mark D. Mayo, Adam Jatkowski, Gerald Strevig, Leon J. Sigal, Ayan Datta, Anne Gattiker, Aditya Bansal, Doug Malone, Thomas Strach, Huajun Wen, Pak-kin Mak, Chung-Lung Kevin Shum, Donald W. Plass, Charles F. Webb:
5.5GHz system z microprocessor and multi-chip module. ISSCC 2013: 46-47
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