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2020 – today
- 2023
[c6]Erik W. Masselink, Andrew Stark, Benjamin B. Yang, T. Robert Harris:
Review of Hybrid Integration Techniques for Integrating III-V Onta Silicon. 3DIC 2023: 1-7
2010 – 2019
- 2019
- [c5]T. Robert Harris, W. Rhett Davis
, Steven Lipa, W. Shepherd Pitts, Paul D. Franzon:
Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages. 3DIC 2019: 1-3 - 2015
- [c4]T. Robert Harris, Eric J. Wyers, Lee Wang, Samuel Graham, Georges Pavlidis, Paul D. Franzon, W. Rhett Davis:
Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks. 3DIC 2015: TS10.2.1-TS10.2.4 - [c3]Eric J. Wyers, T. Robert Harris, Wallace Shep Pitts, Jordan E. Massad, Paul D. Franzon:
Characterization of the mechanical stress impact on device electrical performance in the CMOS and III-V HEMT/HBT heterogeneous integration environment. 3DIC 2015: TS8.27.1-TS8.27.4 - 2014
- [c2]T. Robert Harris, Paul D. Franzon, W. Rhett Davis, Lee Wang:
Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits. 3DIC 2014: 1-3 - 2012
- [j2]Shivam Priyadarshi, T. Robert Harris, Samson Melamed, Carlos Tadeo Ortega Otero, Nikhil Kriplani, Carlos E. Christoffersen, Rajit Manohar, Steven R. Dooley, W. Rhett Davis, Paul D. Franzon, Michael B. Steer:
Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels. IET Circuits Devices Syst. 6(1): 35-44 (2012) - [j1]Samson Melamed, Thorlindur Thorolfsson, T. Robert Harris, Shivam Priyadarshi, Paul D. Franzon, Michael B. Steer, W. Rhett Davis:
Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31(5): 676-689 (2012) - 2010
- [c1]Shivam Priyadarshi, Nikhil Kriplani, Michael B. Steer, T. Robert Harris:
Fast dynamic simulation of VLSI circuits using reduced order compact macromodel of standard cells. BMAS 2010: 75-80
Coauthor Index
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