"Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High ..."

Samson Melamed et al. (2012)

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DOI: 10.1109/TCAD.2011.2180384

access: closed

type: Journal Article

metadata version: 2021-10-14

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Samson Melamed, Thorlindur Thorolfsson, T. Robert Harris, Shivam Priyadarshi, Paul D. Franzon, Michael B. Steer, W. Rhett Davis:
Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31(5): 676-689 (2012)

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