Microelectronics Reliability, Volume 84

Volume 84, May 2018

Special section on ROCS 2017

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  Donald A. Gajewski, Satyaki Ganguly, Scott T. Sheppard, Simon Wood, Jeff B. Barner, Jim W. Milligan, John Palmour:
  Reliability comparison of 28V-50V GaN-on-SiC S-band and X-band technologies. 1-6

Special section on DDECS 2017

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  Lukás Kohútka, Viera Stopjaková:
  Reliable real-time task scheduler based on Rocket Queue architecture. 7-19
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  Tao Hu, Shurong Dong, Hao Jin, Hei Wong, Zekun Xu, Xiang Li, Juin J. Liou:
  A double snapback SCR ESD protection scheme for 28 nm CMOS process. 20-25
• 
  Hosung Lee, Sanghyeon Baeg:
  Signal characteristic and test exploitation for intermittent nanometer-scale cracks. 26-36
• 
  I. Gabsi, Samah Maalej, Mohamed Chaker Zaghdoudi:
  Thermal performance modeling of loop heat pipes with flat evaporator for electronics cooling. 37-47
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  Shao-Chang Huang, Hung-Wei Chen, Jen-Hang Yang, Mi-Chang Chang:
  Improving ESD protection of 5V NMOSFET large array device in 0.4μm BCD process. 48-54
• 
  Jianfeng Li, Jingru Dai, Christopher Mark Johnson:
  Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints. 55-65
• 
  Bijender Kumar, Neeta Khare, P. K. Chaturvedi:
  FPGA-based design of advanced BMS implementing SoC/SoH estimators. 66-74
• 
  Jin-Cherng Shyu, Shu-Kai Jheng:
  Cooling performance and characteristics of metal piezoelectric fans in a heat sink-equipped handheld projector. 75-87
• 
  Tibor Rovensky, Alena Pietrikova, Igor Vehec, Lubomir Livovsky:
  Stability of miniaturized non-trimmed thick- and thin-film resistors. 88-94

Special section on Selected papers from the 21st European Microelectronics and Packaging Conference

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  Arkadiusz Dabrowski, Andrzej Dziedzic:
  Stability of low ohmic thick-film resistors under pulsed operation. 95-104
• 
  Jinxin Zhang, Qi Guo, Hongxia Guo, Wu Lu, Chaohui He, Xin Wang, Pei Li, Lin Wen:
  Investigation of enhanced low dose rate sensitivity in SiGe HBTs by ⁶⁰Co γ irradiation under different biases. 105-111
• 
  Vinicius Fratin, Daniel Oliveira, Philippe O. A. Navaux, Luigi Carro, Paolo Rech:
  Energy-Delay-FIT Product to compare processors and algorithm implementations. 112-120
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  Krzysztof Nieweglowski, Lukas Lorenz, Sebastian Lüngen, Tobias Tiedje, Klaus-Jürgen Wolter, Karlheinz Bock:
  Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems. 121-126
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  Yutaka Komatsu, Seira Yamaguchi, Atsushi Masuda, Keisuke Ohdaira:
  Multistage performance deterioration in n-type crystalline silicon photovoltaic modules undergoing potential-induced degradation. 127-133
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  Ke Zhao, Boan Pan, Zebing Li, Fulin Zhong, Pengbo Wang, Ting Li:
  Performance evaluation for a novel optoelectronic device for noninvasive monitoring thrombosis. 134-139

Special section on selection of best papers of EuroSimE 2017

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  Jiajie Fan, Jianwu Cao, Chaohua Yu, Cheng Qian, Xuejun Fan, Guoqi Zhang:
  A design and qualification of LED flip Chip-on-Board module with tunable color temperatures. 140-148
• 
  J. Lynn Davis, Karmann C. Mills, Georgiy V. Bobashev, Kelley J. Rountree, Michael Lamvik, Robert Yaga, Cortina Johnson:
  Understanding chromaticity shifts in LED devices through analytical models. 149-156
• 
  Zhaozhao Xu, Donghua Liu, Wei Xiong, Jun Hu, Wenting Duan, Hualun Chen, Wensheng Qian, Weiran Kong, Shichang Zou:
  Investigation and impact of LDD variations on the drain disturb in normally-on SONOS NOR flash device. 157-162

Special section on Selected papers from the 21st European Microelectronics and Packaging Conference

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  Lukasz Wozniak, Pawel Kalinowski, Grzegorz Jasinski, Piotr Jasinski:
  FFT analysis of temperature modulated semiconductor gas sensor response for the prediction of ammonia concentration under humidity interference. 163-169
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  Shi-Qian Liu, Stuart D. McDonald, Keith W. Sweatman, Kazuhiro Nogita:
  The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review. 170-180
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  Gennady I. Zebrev, Vasily V. Orlov, Maxim S. Gorbunov, Maxim G. Drosdetsky:
  Physics-based modeling of TID induced global static leakage in different CMOS circuits. 181-186

Special section on Prognostics and Health Management for Electronic Components and Systems

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  Xiao-Jing Yin, Bangcheng Zhang, Zhi-Jie Zhou, Xiaoxia Han, Zhanli Wang, Guan-Yu Hu:
  A new health estimation model for CNC machine tool based on infinite irrelevance and belief rule base. 187-196
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  Subramani Manoharan, Chandradip Patel, F. Patrick McCluskey, Michael G. Pecht:
  Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment. 197-207

Special section on selection of best papers of EuroSimE 2017

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  Ibrahim Khalilullah, Talukder Reza, Liangbiao Chen, Mark D. Placette, A. K. M. Monayem H. Mazumder, Jiang Zhou, Jiajie Fan, Cheng Qian, Guoqi Zhang, Xuejun Fan:
  In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging. 208-214

Special section on Prognostics and Health Management for Electronic Components and Systems

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  Yujie Zhang, Lulu Wang, Shaonian Wang, Peng Wang, Haitao Liao, Yu Peng:
  Auxiliary power unit failure prediction using quantified generalized renewal process. 215-225
• 
  Yiming Lei, Hitoshi Wakabayashi, Kazuo Tsutsui, Hiroshi Iwai, Masayuki Furuhashi, Shingo Tomohisa, Satoshi Yamakawa, Kuniyuki Kakushima:
  Improvement of SiO₂/4H-SiC Interface properties by post-metallization annealing. 226-229
• 
  Srivalli Chellvarajoo, Mohd Zulkifly Abdullah:
  Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality. 230-237
• 
  Mohammad A. Gharaibeh:
  Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology. 238-247
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  Yiming Lei, Hitoshi Wakabayashi, Kazuo Tsutsui, Hiroshi Iwai, Masayuki Furuhashi, Shingo Tomohisa, Satoshi Yamakawa, Kuniyuki Kakushima:
  Effect of lanthanum silicate interface layer on the electrical characteristics of 4H-SiC metal-oxide-semiconductor capacitors. 248-252
• 
  Benkuan Wang, Datong Liu, Wenjuan Wang, Xiyuan Peng:
  A hybrid approach for UAV flight data estimation and prediction based on flight mode recognition. 253-262