Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

International Conference on Technical Debt (TechDebt)

visit
- web page @ acm.org
- web page @ ieee.org
authority control:
export records of this stream
first 1000 hits only:
- XML
- JSON
- JSONP
- RSS
- BibTeX
see FAQ:
- How to use the dblp search API?
BHT key:
- db/conf/techdebt/index.bht
stream key:
- streams/conf/techdebt
ask others
view this stream in
- dblp search
share bibliography
persistent URL:
- https://dblp.org/streams/conf/techdebt
help us
- How can I correct errors in dblp?
- contact dblp

> Home > Conferences and Workshops

Venue statistics

records by year

document access Please note:
▪ This facet is still work in progress.
▪ Open access information for publications is still rather incomplete.

frequent authors

Venue Information

is part of: International Conference on Software Engineering (ICSE)

TechDebt 2023: Melbourne, Australia

- view
  authority control:
- export record
  dblp key:
  - conf/techdebt/2023
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/techdebt/2023
2023 ACM/IEEE International Conference on Technical Debt (TechDebt), Melbourne, Australia, May 14-15, 2023. IEEE 2023, ISBN 979-8-3503-1194-5 [contents]

TechDebt 2022: Pittsburgh, PA, USA

- view
  authority control:
- export record
  dblp key:
  - conf/icse/2022techdebt
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/icse/2022techdebt
Neil A. Ernst, Valentina Lenarduzzi, Tushar Sharma:
TechDebt '22: International Conference on Technical Debt, Pittsburgh Pennsylvania, May 17-18, 2022. ACM 2022, ISBN 978-1-4503-9304-1 [contents]

TechDebt 2021: Madrid, Spain

- view
  authority control:
- export record
  dblp key:
  - conf/icse/2021techdebt
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/icse/2021techdebt
4th IEEE/ACM International Conference on Technical Debt, TechDebt@ICSE 2021, Madrid, Spain, May 19-21, 2021. IEEE 2021, ISBN 978-1-6654-1405-0 [contents]

TechDebt 2020: Seoul, Korea

- view
  authority control:
- export record
  dblp key:
  - conf/icse/2020techdebt
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/icse/2020techdebt
Clemente Izurieta, Matthias Galster, Michael Felderer:
TechDebt '20: International Conference on Technical Debt, Seoul, Republic of Korea, June 28-30, 2020. ACM 2020, ISBN 978-1-4503-7960-1 [contents]

TechDebt 2019: Montreal, QC, Canada

- view
- export record
  dblp key:
  - conf/icse/2019techdebt
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/icse/2019techdebt
Paris Avgeriou, Klaus Schmid:
Proceedings of the Second International Conference on Technical Debt, TechDebt@ICSE 2019, Montreal, QC, Canada, May 26-27, 2019. IEEE / ACM 2019, ISBN 978-1-7281-3371-3 [contents]

TechDebt 2018: Gothenburg, Sweden

- view
  authority control:
- export record
  dblp key:
  - conf/icse/2018techdebt
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/icse/2018techdebt
Robert L. Nord, Frank Buschmann, Philippe Kruchten:
Proceedings of the 2018 International Conference on Technical Debt, TechDebt@ICSE 2018, Gothenburg, Sweden, May 27-28, 2018. ACM 2018 [contents]

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.