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"Proceedings of the Second International Conference on Technical Debt, ..."
Paris Avgeriou, Klaus Schmid (2019)
- Paris Avgeriou, Klaus Schmid:
Proceedings of the Second International Conference on Technical Debt, TechDebt@ICSE 2019, Montreal, QC, Canada, May 26-27, 2019. IEEE / ACM 2019, ISBN 978-1-7281-3371-3 [contents]
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