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TechDebt@ICSE 2025: Ottawa, ON, Canada
- IEEE/ACM International Conference on Technical Debt, TechDebt@ICSE 2025, Ottawa, ON, Canada, April 27-28, 2025. IEEE 2025, ISBN 979-8-3315-0221-8
- Nilay Yorgancilar Akgül, Tugba Taskaya-Temizel, Özden Özcan Top, Pelin Dayan Akman:
Aligning Data Debt with AI-Integrated Software Project Lifecycle Processes: A Standard-Based Mapping Approach. 1-11 - João Paulo Biazotto, Daniel Feitosa, Paris Avgeriou, Elisa Yumi Nakagawa:
Automating Technical Debt Management: Insights from Practitioner Discussions in Stack Exchange. 12-22 - Marion Wiese, Angelina Heinrichs, Nino Rusieshvili, Rodrigo Rebouças de Almeida, Klara Borowa:
The TechDebt Game - Enabling Discussions about Technical Debt. 23-33 - Fardin Aryan, Lucas Valença, Ronnie de Souza Santos:
Exploring Fairness Debt Through Evidence from Studies on Algorithmic Discrimination. 34-39 - Mounifah Alenazi:
Requirements Technical Debt Through the Lens of Environment Assumptions. 40-46

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