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ORCIDISPD 2024: Taipei, Taiwan
- Iris Hui-Ru Jiang, Gracieli Posser:
Proceedings of the 2024 International Symposium on Physical Design, ISPD 2024, Taipei, Taiwan, March 12-15, 2024. ACM 2024
Session 1: Opening Session and First Keynote
- Ruchir Puri
:
Engineering the Future of IC Design with AI. 1
Session 2: Partitioning and Clustering
- Rongjian Liang, Anthony Agnesina, Haoxing Ren:
MedPart: A Multi-Level Evolutionary Differentiable Hypergraph Partitioner. 3-11 - Shuo Yin, Wenqian Zhao, Li Xie, Hong Chen, Yuzhe Ma, Tsung-Yi Ho, Bei Yu:
FuILT: Full Chip ILT System With Boundary Healing. 13-20 - Yen-Yu Chen, Hao-Yu Wu, Iris Hui-Ru Jiang, Cheng-Hong Tsai, Chien-Cheng Wu:
Slack Redistributed Register Clustering with Mixed-Driving Strength Multi-bit Flip-Flops. 21-29
Session 3: Timing Optimization
- Wuxi Li, Yuji Kukimoto, Grégory Servel, Ismail Bustany, Mehrdad E. Dehkordi:
Calibration-Based Differentiable Timing Optimization in Non-linear Global Placement. 31-39 - Wei-Chen Tai, Min-Hsien Chung, Iris Hui-Ru Jiang:
Novel Airgap Insertion and Layer Reassignment for Timing Optimization Guided by Slack Dependency. 41-49 - Tsung-Wei Huang, Boyang Zhang, Dian-Lun Lin, Cheng-Hsiang Chiu:
Parallel and Heterogeneous Timing Analysis: Partition, Algorithm, and System. 51-59
Session 4: Panel on EDA Challenges at Advanced Technology Nodes
- Tung-Chieh Chen:
Introduction to the Panel on EDA Challenges at Advanced Technology Nodes. 61 - Andrew B. Kahng:
Panel Statement: EDA Needs at Advanced Technology Nodes. 63 - Zhuolun He, Bei Yu:
Large Language Models for EDA: Future or Mirage? 65-66 - Eugene Liu:
PANEL: EDA Challenges at Advanced Technology Nodes A. 67 - Guang-Wan Liao:
PANEL: EDA Challenges at Advanced Technology Nodes B. 69 - I-Lun Tseng:
Challenges in Floorplanning and Macro Placement for Modern SoCs. 71-72 - Keh-Jeng Chang:
PANEL: EDA Challenges at Advanced Technology Nodes C. 73
Session 5: 3D ICs
- Siting Liu, Jiaxi Jiang, Zhuolun He, Ziyi Wang, Yibo Lin, Bei Yu, Martin D. F. Wong:
Routing-aware Legal Hybrid Bonding Terminal Assignment for 3D Face-to-Face Stacked ICs. 75-82 - Wang-Tyng Lay:
Unified 3D-IC Multi-Chiplet System Design Solution. 83 - Jun-Ho Choy, Stéphane Moreau, Catherine Brunet-Manquat, Valeriy Sukharev, Armen Kteyan:
Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects. 85-90 - Wen-Hao Liu, Anthony Agnesina, Haoxing Mark Ren:
Challenges for Automating PCB Layout. 91-92
Session 6: Artificial Intelligence and Machine Learning
- Hao-Hsiang Hsiao, Yi-Chen Lu, Pruek Vanna-Iampikul, Sung Kyu Lim:
FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning. 93-101 - Suwan Kim, Hyunbum Park, Kyeonghyeon Baek, Kyumyung Choi, Taewhan Kim:
Methodology of Resolving Design Rule Checking Violations Coupled with Fully Compatible Prediction Model. 103-111 - Erick Chao:
AI for EDA/Physical Design: Driving the AI Revolution: The Crucial Role of 3D-IC. 113 - Piyush Verma:
DSO.ai - A Distributed System to Optimize Physical Design Flows. 115-116 - Andrew B. Kahng:
Solvers, Engines, Tools and Flows: The Next Wave for AI/ML in Physical Design. 117-124
Session 7: Second Keynote
- Yao-Wen Chang:
Physical Design Challenges in Modern Heterogeneous Integration. 125-134
Session 8: Analog
- Jürgen Scheible:
Fundamental Differences Between Analog and Digital Design Problems - An Introduction. 135-136 - Andreas Krinke, Robert Fischbach, Jens Lienig:
Layout Verification Using Open-Source Software. 137-142 - Mark Po-Hung Lin, Chou-Chen Lee, Yi-Chao Hsieh:
Reinforcement Learning or Simulated Annealing for Analog Placement? A Study based on Bounded-Sliceline Grids. 143-150
Session 9: Placement
- Teng-Ping Huang, Shao-Yun Fang:
Practical Mixed-Cell-Height Legalization Considering Vertical Cell Abutment Constraint. 151-159 - Yu Zhang, Yuan Pu, Fangzhou Liu, Peiyu Liao, Kai-Yuan Chao, Keren Zhu, Yibo Lin, Bei Yu:
Multi-Electrostatics Based Placement for Non-Integer Multiple-Height Cells. 161-168 - Yuan Pu, Tinghuan Chen, Zhuolun He, Chen Bai, Haisheng Zheng, Yibo Lin, Bei Yu:
IncreMacro: Incremental Macro Placement Refinement. 169-176 - Jai-Ming Lin, You-Yu Chang, Wei-Lun Huang:
Timing-Driven Analytical Placement According to Expected Cell Distribution Range. 177-184
Session 10: Standard Cell, Routability, and IR drop
- Bing-Xun Song, Ting Xin Lin, Yih-Lang Li:
Routability Booster " Synthesize a Routing Friendly Standard Cell Library by Relaxing BEOL Resources. 185-193 - Chia-Tung Ho, Ajay Chandna, David Guan, Alvin Ho, Minsoo Kim, Yaguang Li, Haoxing Ren:
Novel Transformer Model Based Clustering Method for Standard Cell Design Automation. 195-203 - Chien-Pang Lu, Iris Hui-Ru Jiang, Chung-Ching Peng, Mohd Mawardi Mohd Razha, Alessandro Uber:
Power Sub-Mesh Construction in Multiple Power Domain Design with IR Drop and Routability Optimization. 205-212
Session 11: Thermal Analysis and Packaging
- Alex Hung:
Introduction of 3D IC Thermal Analysis Flow. 213 - Jim Chang:
3Dblox: Unleash the Ultimate 3DIC Design Productivity. 215 - Hung-Ming Chen:
Enabling System Design in 3D Integration: Technologies and Methodologies. 217
Session 12: Lifetime Achievement Session
- Jason Cong:
Scheduling and Physical Design. 219-225 - Evangeline F. Y. Young:
Accelerating Physical Design from 1 to N. 227 - Ting-Chi Wang:
Pioneering Contributions of Professor Martin D. F. Wong to Automatic Floorplan Design. 229 - Martin D. F. Wong:
ISPD 2024 Lifetime Achievement Award Bio. 231
Session 13: Third Keynote
- Bor-Sung Liang:
Computing Architecture for Large-Language Models (LLMs) and Large Multimodal Models (LMMs). 233-234
Session 14: Quantum and Superconducting Circuits
- Zi-Hao Guo, Ting-Chi Wang:
SMT-Based Layout Synthesis Approaches for Quantum Circuits. 235-243 - Wei-Hsiang Tseng, Yao-Wen Chang, Jie-Hong Roland Jiang:
Satisfiability Modulo Theories-Based Qubit Mapping for Trapped-Ion Quantum Computing Systems. 245-253 - Bing-Huan Wu, Wai-Kei Mak:
Optimization for Buffer and Splitter Insertion in AQFP Circuits with Local and Group Movement. 255-262
Session 15: Physical Design Challenges for Automotive
- Chung-Wei Lin:
Design Automation Challenges for Automotive Systems. 263 - Goeran Jerke:
Physical Design Challenges for Automotive ASICs. 265 - Rob Knoth:
Solving the Physical Challenges for the Next Generation of Safety Critical & High Reliability Systems. 267
Session 16: Contest Results and Closing Remarks
- Rongjian Liang, Anthony Agnesina, Wen-Hao Liu, Haoxing Ren:
GPU/ML-Enhanced Large Scale Global Routing Contest. 269-274
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