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ORCIDPruek Vanna-Iampikul
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2020 – today
- 2025
[j5]Pruek Vanna-Iampikul
, Seungmin Woo, Serhat Erdogan, Lingjun Zhu, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Madhavan Swaminathan, Sung Kyu Lim:
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 44(5): 1954-1967 (2025)- [c13]Hao-Hsiang Hsiao, Yi-Chen Lu, Pruek Vanna-Iampikul, Anthony Agnesina, Rongjian Liang, Yuan-Hsiang Lu, Haoxing Ren, Sung Kyu Lim:
DCO-3D: Differentiable Congestion Optimization in 3D ICs. DAC 2025: 1-7 - [c12]Jiawei Hu, Pruek Vanna-Iampikul, Zhen Zhuang, Tsung-Yi Ho, Sung Kyu Lim:
GNN-MLS: Signal Routing in Mixed-Node 3D ICs through GNN-Assisted Metal Layer Sharing. DAC 2025: 1-7 - [c11]Pruek Vanna-Iampikul, Jun-Sik Yoon, Chaeryung Park, Gary Yeap, Sung Kyu Lim:
Placement-Aware 3D Net-to-Pad Assignment for Array-Style Hybrid Bonding 3D ICs. ISPD 2025: 200-208 - 2024
- [c10]Hao-Hsiang Hsiao, Pruek Vanna-Iampikul, Yi-Chen Lu, Sung Kyu Lim:
ML-based Physical Design Parameter Optimization for 3D ICs: From Parameter Selection to Optimization. DAC 2024: 252:1-252:6 - [c9]Nesara Eranna Bethur, Pruek Vanna-Iampikul, Odysseas Zografos, Lingjun Zhu, Giuliano Sisto, Dragomir Milojevic, Alberto García Ortiz, Geert Hellings, Julien Ryckaert, Francky Catthoor, Sung Kyu Lim:
GNN-assisted Back-side Clock Routing Methodology for Advance Technologies. DAC 2024: 287:1-287:6 - [c8]Seungmin Woo, Pruek Vanna-Iampikul, Sung Kyu Lim:
AI-Driven Evaluation and Optimization of Bump Pitch Effects on Chiplet and Interposer Design Quality. ICCAD 2024: 140:1-140:9 - [c7]Boxun Xu, Junyoung Hwang, Pruek Vanna-Iampikul, Sung Kyu Lim, Peng Li:
Spiking Transformer Hardware Accelerators in 3D Integration. ICCAD 2024: 229:1-229:9 - [c6]Hao-Hsiang Hsiao, Yi-Chen Lu, Pruek Vanna-Iampikul, Sung Kyu Lim:
FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning. ISPD 2024: 93-101 - [c5]Pruek Vanna-Iampikul, Hang Yang, Jungyoun Kwak, Joyce X. Hu, Amaan Rahman, Nesara Eranna Bethur, Callie Hao, Shimeng Yu, Sung Kyu Lim:
Back-side Design Methodology for Power Delivery Network and Clock Routing. VLSI Technology and Circuits 2024: 1-2 - [i2]Boxun Xu, Junyoung Hwang, Pruek Vanna-Iampikul, Sung Kyu Lim, Peng Li:
Spiking Transformer Hardware Accelerators in 3D Integration. CoRR abs/2411.07397 (2024) - [i1]Boxun Xu, Junyoung Hwang, Pruek Vanna-Iampikul, Yuxuan Yin, Sung Kyu Lim, Peng Li:
Towards 3D Acceleration for low-power Mixture-of-Experts and Multi-Head Attention Spiking Transformers. CoRR abs/2412.05540 (2024) - 2023
- [j4]Jeffrey S. Vetter, Prasanna Date, Farah Fahim, Shruti R. Kulkarni, Petro Maksymovych, A. Alec Talin, Marc González Tallada, Pruek Vanna-Iampikul, Aaron R. Young, David Brooks, Yu Cao, Gu-Yeon Wei, Sung Kyu Lim, Frank Liu, Matthew J. Marinella, Bobby G. Sumpter, Narasinga Rao Miniskar:
Abisko: Deep codesign of an architecture for spiking neural networks using novel neuromorphic materials. Int. J. High Perform. Comput. Appl. 37(3-4): 351-379 (2023) - [j3]Pruek Vanna-Iampikul, Chengjia Shao, Yi-Chen Lu, Sai Pentapati, Yun Heo, Jae-Seung Choi, Sung Kyu Lim:
Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(7): 2331-2335 (2023) - [j2]Pruek Vanna-Iampikul, Yi-Chen Lu, Da Eun Shim, Sung Kyu Lim:
GNN-based Multi-bit Flip-flop Clustering and Post-clustering Design Optimization for Energy-efficient 3D ICs. ACM Trans. Design Autom. Electr. Syst. 28(5): 76:1-76:26 (2023) - [c4]Pruek Vanna-Iampikul, Lingjun Zhu, Serhat Erdogan, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Sung Kyu Lim:
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits. DAC 2023: 1-6 - [c3]Narasinga Rao Miniskar, Pruek Vanna-Iampikul, Aaron R. Young, Sung Kyu Lim, Frank Liu, Jieun Yoo, Corrinne Mills, Nhan Tran, Farah Fahim, Jeffrey S. Vetter:
A 3D Implementation of Convolutional Neural Network for Fast Inference. ISCAS 2023: 1-5 - 2022
- [j1]Lingjun Zhu, Arjun Chaudhuri, Sanmitra Banerjee, Gauthaman Murali, Pruek Vanna-Iampikul, Krishnendu Chakrabarty, Sung Kyu Lim:
Design Automation and Test Solutions for Monolithic 3D ICs. ACM J. Emerg. Technol. Comput. Syst. 18(1): 21:1-21:49 (2022) - 2021
- [c2]Pruek Vanna-Iampikul, Chengjia Shao, Yi-Chen Lu, Sai Pentapati, Sung Kyu Lim:
Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs. ISPD 2021: 39-46 - 2020
- [c1]Jinwoo Kim, Gauthaman Murali, Pruek Vanna-Iampikul, Edward Lee, Daehyun Kim, Arjun Chaudhuri, Sanmitra Banerjee, Krishnendu Chakrabarty, Saibal Mukhopadhyay, Sung Kyu Lim:
RTL-to-GDS Design Tools for Monolithic 3D ICs. ICCAD 2020: 126:1-126:8
Coauthor Index
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