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Publication search results
found 422 matches
- 2015
- Paolo Lorenzi, Rosario Rao, Fernanda Irrera:
Conductive filament evolution in HfO2 resistive RAM device during constant voltage stress. Microelectron. Reliab. 55(9-10): 1446-1449 (2015) - Carmine Abbate, Giovanni Busatto, Francesco Iannuzzo, S. Mattiazzo, Annunziata Sanseverino, L. Silvestrin, D. Tedesco, Francesco Velardi:
Experimental study of Single Event Effects induced by heavy ion irradiation in enhancement mode GaN power HEMT. Microelectron. Reliab. 55(9-10): 1496-1500 (2015) - N. Abdelwahed, M. Troudi, Nabil Sghaier, Abdelkader Souifi:
Impact of defect on I(V) instabilities observed on Ti/4H-SiC high voltage Schottky diodes. Microelectron. Reliab. 55(8): 1169-1173 (2015) - K. Adokanou, Karim Inal, Pierre Montmitonnet, F. Pressecq, Barbara Bonnet, J. L. Muraro:
Investigation on the effect of external mechanical stress on the DC characteristics of GaAs microwave devices. Microelectron. Reliab. 55(9-10): 1697-1702 (2015) - O. A. Ageev, Alexey S. Kolomiytsev, A. V. Bykov, V. A. Smirnov, I. N. Kots:
Fabrication of advanced probes for atomic force microscopy using focused ion beam. Microelectron. Reliab. 55(9-10): 2131-2134 (2015) - A. Ahilan, P. Deepa:
Design for built-in FPGA reliability via fine-grained 2-D error correction codes. Microelectron. Reliab. 55(9-10): 2108-2112 (2015) - M. T. Alam, K. E. Maletto, J. Bielefeld, Sean W. King, M. Aman Haque:
Mechanical stress field assisted charge de-trapping in carbon doped oxides. Microelectron. Reliab. 55(5): 846-851 (2015) - R. Alberti, Riccardo Enrici Vaion, A. Mervic, S. Testa:
Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism. Microelectron. Reliab. 55(9-10): 1838-1842 (2015) - Javad Alirezaeyan, Saleh Yousefi, Ali Doniavi:
Adaptive reliability satisfaction in wireless sensor networks through controlling the number of active routing paths. Microelectron. Reliab. 55(11): 2412-2422 (2015) - Atif Alkhazaili, Mohammad M. Hamasha, Gihoon Choi, Susan Lu, Charles R. Westgate:
Reliability of thin films: Experimental study on mechanical and thermal behavior of indium tin oxide and poly(3, 4-ethylenedioxythiophene). Microelectron. Reliab. 55(3-4): 538-546 (2015) - Carmen G. Almudéver, Antonio Rubio:
Variability and reliability analysis of CNFET technology: Impact of manufacturing imperfections. Microelectron. Reliab. 55(2): 358-366 (2015) - Ting An, Kaikai Liu, Hao Cai, Lirida A. B. Naviner:
Accurate reliability analysis of concurrent checking circuits employing an efficient analytical method. Microelectron. Reliab. 55(3-4): 696-703 (2015) - Houssam Arbess, F. Baccar, L. Théolier, Stephane Azzopardi, Eric Woirgard:
Mechanical stress investigation after technological process in Deep Trench Termination DT2 using BenzoCycloButene as dielectric material. Microelectron. Reliab. 55(9-10): 2017-2021 (2015) - Houssam Arbess, Marise Bafleur, David Trémouilles, Moustafa Zerarka:
Optimization of a MOS-IGBT-SCR ESD protection component in smart power SOI technology. Microelectron. Reliab. 55(9-10): 1476-1480 (2015) - Daniel Arbet, Viera Stopjaková, Martin Kovác:
Investigation of the optimum oscillation frequency value towards increasing the efficiency of OBIST approach. Microelectron. Reliab. 55(7): 1120-1125 (2015) - Mark Ashworth, Geoffrey D. Wilcox, Rebecca L. Higginson, Richard J. Heath, Chanqing Liu, Roger J. Mortimer:
The effect of electroplating parameters and substrate material on tin whisker formation. Microelectron. Reliab. 55(1): 180-191 (2015) - Jean-Luc Autran, Daniela Munteanu:
Radiation and COTS at ground level. Microelectron. Reliab. 55(9-10): 2147-2153 (2015) - Jean-Luc Autran, Daniela Munteanu, Soilihi Moindjie, Tarek Saad Saoud, S. Sauze, Gilles Gasiot, Philippe Roche:
ASTEP (2005-2015): Ten years of soft error and atmospheric radiation characterization on the Plateau de Bure. Microelectron. Reliab. 55(9-10): 1506-1511 (2015) - Ala Ayed, Tristan Dubois, Jean-Luc Levant, Geneviève Duchamp:
Failure mechanism study and immunity modeling of an embedded analog-to-digital converter based on immunity measurements. Microelectron. Reliab. 55(9-10): 2067-2071 (2015) - F. Baccar, Houssam Arbess, L. Théolier, Stephane Azzopardi, Eric Woirgard:
Ageing mechanisms in Deep Trench Termination (DT2) Diode. Microelectron. Reliab. 55(9-10): 1981-1987 (2015) - Marise Bafleur, Philippe Perdu, François Marc, Hélène Frémont, Nicolas Nolhier:
Editorial. Microelectron. Reliab. 55(9-10): 1269-1270 (2015) - Marta Bagatin, Simone Gerardin:
Soft errors in floating gate memory cells: A review. Microelectron. Reliab. 55(1): 24-30 (2015) - Amin Bagheri, Mahboubeh Ranjbar, Saeed Haji-Nasiri, Sattar Mirzakuchaki:
Crosstalk bandwidth and stability analysis in graphene nanoribbon interconnects. Microelectron. Reliab. 55(8): 1262-1268 (2015) - Raphael Baillot, Yannick Deshayes, Yves Ousten, Laurent Béchou:
Photothermal activated failure mechanism in polymer-based packaging of low power InGaN/GaN MQW LED under active storage. Microelectron. Reliab. 55(9-10): 1759-1764 (2015) - P. Balasubramanian, Douglas L. Maskell:
A distributed minority and majority voting based redundancy scheme. Microelectron. Reliab. 55(9-10): 1373-1378 (2015) - Samed Barnat, Alexandrine Guédon-Gracia, Hélène Frémont:
Virtual prototyping in a Design-for-Reliability approach. Microelectron. Reliab. 55(9-10): 1849-1854 (2015) - Mohamed Ali Belaïd:
Impact of hot carrier injection on switching time evolution for power RF LDMOS after accelerated tests. Microelectron. Reliab. 55(9-10): 2041-2044 (2015) - Yannis Belfort, J.-M. Caignard, S. Keller, J.-P. Guerveno:
Failures on DC-DC modules following a change of wire bonding material from gold to copper. Microelectron. Reliab. 55(9-10): 2003-2006 (2015) - A. Bensoussan, Ephraim Suhir, P. Henderson, M. Zahir:
A unified multiple stress reliability model for microelectronic devices - Application to 1.55 μm DFB laser diode module for space validation. Microelectron. Reliab. 55(9-10): 1729-1735 (2015) - M. Béranger:
Use of a silicon drift detector for cathodoluminescence detection. Microelectron. Reliab. 55(9-10): 1569-1573 (2015)
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